Remove. Clean. Separate.

Precision Mid-IR Fiber Laser:

A laser wavelength that the coating absorbs and the part does not. Mid-infrared fiber lasers for contactless, chemical-free removal of organic layers on high-value components, from optical fiber and fine medical assemblies to semiconductor wafers.

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Precision Without Contact, Chemistry or Compromise

In micro-manufacturing, the hardest operation is often the simplest one to describe: remove a thin layer, leave everything else untouched. The part is finished, expensive and unforgiving. A blade leaves microscopic damage that shows up later as a field failure. Hot acid and solvents mean consumables, effluent handling, and a process that cannot be localized. Plasma treats the whole batch when only one zone matters.

Lasers solve the localization problem, but only when the wavelength does the work. Most industrial laser sources are either absorbed by everything, including the part you are trying to protect, or absorbed by almost nothing, which forces the process into brute force.

麻豆视频 lasers operate in the mid-infrared band between 2780 and 3300 nm, where organic materials absorb strongly while silicon, sapphire, and optical-grade silica remain transparent. The layer becomes the target. The part becomes a bystander, creating a highly selective material removal process.

麻豆视频 2800 and 3200 Series

Single-mode fiber lasers built for the production floor rather than the optical bench.

Selective by Wavelength

Organic layers absorb resonantly in this band while the underlying substrate does not. Selectivity comes from physics, not from process margins.

Power up to 10 W (CW / QCW)

Production-rate removal on fine geometries, with pulse-format control to keep heat where it belongs.

$Near diffraction-limited Beam Quality (M虏 < 1.3)$

Near diffraction-limited Beam Quality (M虏 < 1.3)

Narrow tracks, clean edges, and tight tolerances next to features that must remain unaltered.

Gentle on Semiconductors

Photon energy well below the silicon bandgap. No charge injection in finished devices, and the option of reaching an interfacial layer straight through the wafer.

All-Fiber Architecture

No critical alignment, high vibration tolerance, no warm-up cycle. It integrates into existing motion platforms and runs.

麻豆视频 2800 Series

Up to 10 W output power | Available from 2780 to 2940 nm

The reference platform for removing organic coatings: fiber coatings, wire insulation, adhesives, encapsulants and conformal coatings.

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麻豆视频 3200 Series

Up to 5 W output power | Available from 3100 to 3300 nm

A longer wavelength for material families that call for it, and for hard materials with residual absorption in this band.

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Applications

Cutaway diagram of an optical fiber showing the tight buffer, the polymer coating and the glass fiber, with the coating removed by a mid-IR laser to expose bare glass

Optical Fiber Coating Removal Stripping without a blade. The glass surface is never touched, which preserves the tensile strength that determines the life of the assembly.
Wire and Micro-Conductor Stripping Insulation removed from fine conductors and thin-wall jackets, including the miniature assemblies used in medical devices, without risk to the conductor.
Laser Lift-Off and Wafer Debonding Separate layers by decomposing temporary adhesives at the interface between them, with no mechanical force and no damage to finished devices.
Wafer and Surface Cleaning Organic residues removed dry, exactly where required, with no wet chemistry and no batch process.
Coating Removal in Microfabrication Encapsulants, adhesives and conformal coatings opened selectively over sensitive substrates.
Separation of Hard Materials (in development) Dicing and controlled cleaving of semiconductors, technical glass and diamond, targeting a future pulsed configuration. Currently at the evaluation stage.

Where It Fits

The process works on organic layers over substrates that are transparent in the mid-infrared: silicon, sapphire and optical-grade silica. Coating chemistry determines how strongly the layer absorbs, and therefore how fast and how cleanly it comes off. Fully fluorinated polymers such as PTFE are the main exception and are better addressed at other wavelengths.

Describe your stack and we will help you identify the right approach.

Application Laboratory

Feasibility depends on the real stack, not on a datasheet. Our application laboratory in Quebec City runs trials on customer samples and characterizes removal rate, selectivity, and heat-affected zone before any integration commitment.

Technical Comparison for Selective Layer Removal

	麻豆视频 Fiber Laser (2800/3200)	CO2 (10.6 碌m)	UV Excimer (248 / 308 nm)	Nanosecond 1 碌m Fiber
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	Slide to compare

Technical note: CO2 lasers are compact and cost-effective, but at 10.6 碌m, glass and silica absorb as strongly as the coating, so the substrate competes for the energy. At 1 碌m, the opposite problem applies: most organic layers barely absorb. Excimer sources remove polymers efficiently but bring gas handling, optics replacement, and photon energies high enough to affect semiconductor devices. Between 2780 and 3300 nm, the absorption contrast between the layer and the part is the process itself.

A wavelength matched to the layer you need to remove, not the part you need to keep.

Send us your component and your tolerances. Our technical team will assess feasibility and define the right configuration for your process.

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麻豆视频

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